By KHT AI Agent / Staff
With advanced packaging capacity still tight across the supply chain, Kaohsiung has secured a high-value manufacturing project. Bai Ding Technology (佰鼎科技), a subsidiary under Zhen Ding Group (臻鼎集團), plans to invest NT$80 billion to establish an FCBGA (flip-chip ball grid array) substrate manufacturing base in the Southern Taiwan Science Park Kaohsiung Park (南科高雄園區). The project was approved on January 30, 2026, by the Ministry of Economic Affairs (MOEA, 經濟部) via the Investment Taiwan Office (投資台灣事務所).
Smart manufacturing plus sustainability, built into the plan
Beyond capacity, the proposal emphasizes execution discipline: a smart production line designed around AI-driven automated scheduling and intelligent quality inspection. On the sustainability side, the planned factory setup includes solar power and a wastewater recycling system, aligning output goals with lower operational footprint expectations increasingly demanded by global customers and procurement teams.
“High yield, low carbon” is the underlying operating logic, enabled through automation and resource recycling.
Why this site matters for AI and HPC delivery speed
FCBGA substrates are a critical foundation for advanced packaging, including 2.5D and 3D integration used in AI and high-performance computing systems. By placing capacity in Kaohsiung, Bai Ding adds geographic flexibility to Taiwan’s packaging and substrates network, potentially improving lead times and resilience for downstream assembly and system builders.
The project is also expected to create about 296 local jobs, reinforcing the region’s growing “southbound” semiconductor supply chain corridor that links Kaohsiung’s industrial zones with science-park infrastructure. Importantly, the investment is part of the Invest Taiwan Three Major Programs (投資台灣三大方案) framework, which provides a structured pathway for approvals and ongoing coordination as ramp-up milestones approach.
Summary
Key figures disclosed in public reporting (amounts in NT$):
| Metric | Value | Notes |
|---|---|---|
| Bai Ding Kaohsiung investment | 80 billion | FCBGA substrate smart production base |
| Estimated local jobs created | ~296 | Kaohsiung-area employment impact |
| Total investment of 3 approved cases | >109 billion | Approved on Jan 30, 2026 |
| Invest Taiwan programs (cumulative) | ~2.6 trillion | Reported cumulative scale, alongside job totals |
| Invest Taiwan programs (cumulative jobs) | ~165,033 | Reported cumulative job creation estimate |
Sources & References
Project approval and disclosed plan items (Jan 30, 2026) — Central News Agency (CNA);
Employment and smart line highlights — Economic Daily News (UDN);
Context on advanced packaging substrates and demand framing — Liberty Times;
Invest Taiwan programs cumulative scale and extension reporting — CNA (Jan 28, 2026);
AI server shipment growth outlook (external demand driver) — TrendForce.
